nlancaster wrote:Adrian, I think you may have missed my question. Did you have to do anything special to drive that heater cartridge? Are you still running on the stock controller board?
I did miss it mate, sorry! As Sanjay said, the Sang is fine to run the cartridge in and unto itself... The cartridge is about 3.6Ohm and will draw around 3.33Amps at 100% duty cycle.. however in practice mine is only ever running at 100% duty during the first 2 minutes of heatup and thereafter hovers at about 50% duty..
The current 4.8Ohm power resistors are running at 2.5Amps anyway, so its only .8 amps more... So the only issue I would consider is the standard PSU for the Solidoodle; depending on what heat bed you have and how many extra fans you are running, it may or may not be an issue. I don't like running PSU's too close to their rated power anyway, so have an upgraded 40Amp PSU so it only has to run at 50% load instead of 100% load (means it runs cooler... among many other things... )
But for full disclosure; I don't run the Sang anymore as I prefer a RAMPS with the extra functionality it offers... (too numerous to list, the least being 5 x Drivers, better LCD options, more pins to play with, etc). However the standard sang will do it quite comfortably as its still well within the specs for the MOSFET and only fractionally higher than the OEM provided solution...
DePartedPrinter wrote:Sounds expensive. Are there any major benefits over the air cooled version?
I'm guessing here, but I'd suggest compactness and a reliable consistent set point and multiple extrusion temperatures. With air cooled heads running multiple materials (say PLA and ABS) you need to keep a reasonable amount of physical separation to ensure temperature isolation. With a water cooled 4 nozzle solution; if each nozzle is separately jacketed then its plausible that the required offset of each nozzle will be massively reduced. You could hang all 4 nozzles in a space not much bigger than the current print head. Using a traditional dual- or even tri-strusion setup would mean we'd loose half our build area due to separation, or we'd need a printer with twice as long an X-Axis This way you could have 4 nozzles in relatively close proximity.
And as mentioned, thermal isolation would play a factor. A 220°C extruder right next to a 190°C extruder that only have ambient to dissipate to, would be wildly competing with each other. The 220 dragged down and the 190 pulled up....
The decision as to if they are direct drive or extrusion based is probably a consideration at that point - I imagine for ultimate compactness you'd run as a bowden setup to get the smallest possible head foot print.
Plus the water cooling means that you'd be able to maintain a consistent temperature over a print for each individual nozzle compared to cooling to ambient - just like in PC cooling it may not *lower* your temps over ambient cooling (in fact, aggressive active cooling can probably get lower than standard water cooling) however with a reasonable flow rate you can *maintain* that set point longer.. so even when the PC's at 100% CPU it will only be a few degrees higher than Idle with a good tuned water setup... but it may not be lower than you could achieve at idle with active air, but it will be a lot more consistent...
Anyway, I have no idea - I'm just hypothesizing; haven't even seen a mechanical drawing for it!