ok .. here are some number (from http://www.engineeringtoolbox.com/linea … d_95.html)
units: 10^-6 m/(m K))
ABS: 73.8
Plate Glass: 9.0
Pyrex: 4.0
PLA is oddly missing from the internet(at least my brief attempts), but i found someone's MSDS that listed their "nylon grade" PLA at 9.0
Given a 150mm build plate and a 150mm print: This means that given a cool temperature of about 50C (when i get impatient and start poking at the prints) and hot of 100C (my build platform temp of choice) that means that while cooling:
ABS will shrink 0.5535mm
plate glass will shrink 0.0196mm
borosilicate will shrink 0.0087mm
<values calculated with tool at above link)
It seems that although borosilicate changes at less than half the rate of plate glass, The percentage difference between ABS and either make the difference seem moot.
Assuming we calculate stress at extrusion temperature (195c):
ABS will shrink 1.0515mm over 150mm extremely quickly when it hits the build platform (195 to 100c).
So the math says that for ABS (assuming I'm understanding it, which is rarely) plate vs boro differences are probably moot once considering other factors.
Now assuming that PLA value i pulled randomly is vaguely accurate. Plate and PLA shrinkage basically identical. Boro on the other hand shrinks more than 50%. Does that translate to more self separation than ABS?
Also:
Kapton (which is polyamide tape ..i think?) rates at 110 ..so it moves more than ABS.
I cant find PVA (which is the basis for pretty much all the hairspray, glue stick, elmers based washes)
PET (which according to amazon sellers is the greatest newest thing for 3d printing) runs at 59.4
So summary, I'm not surprised the kapton tape adhesive fatigues as it is moving almost as much as the prints do.
So now the new question is:
What is the optimum difference in thermal expansion that will ensure sticking while at the same time allowing a high probability of self seperation?